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| Imaging the atomic-scale electronic states induced by a pair of hole dopants in Ca2CuO2Cl2 Mott insulator [期刊论文] Science Bulletin, 2021-01-01, 66 (14 Li H.; Ye S.; Zhao J.; Jin C.; Wang Y.
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| Multi-dimensional wave steering with higher-order topological phononic crystal [期刊论文] Science Bulletin, 2021-01-01, 66 (17 Xu C.; Chen Z.-G.; Zhang G.; Ma G.; Wu Y.
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| Demonstration of topological wireless power transfer [期刊论文] Science Bulletin, 2021-01-01, 66 (10 Zhang L.; Yang Y.; Jiang Z.; Chen Q.; Yan Q.; Wu Z.; Zhang B.; Huangfu J.; Chen H.
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| Selection of building thermal insulation materials using robust optimization [期刊论文] International Journal of Life Cycle Assessment, 2020-01-01, 25 (3 Sun M.; Haskell W.B.; Ng T.S.; Ee A.W.L.; Kua H.W.
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| Experimental realization of a reconfigurable electroacoustic topological insulator [期刊论文] Proceedings of the National Academy of Sciences of the United States of America, 2020-01-01, 117 (28 Darabi A.; Collet M.; Leamy M.J.
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| Energy security in Pakistan: Perspectives and policy implications from a quantitative analysis [期刊论文] Energy Policy, 2020-01-01, 144 Malik S.; Qasim M.; Saeed H.; Chang Y.; Taghizadeh-Hesary F.
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| Ultra-light MXene aerogel/wood-derived porous carbon composites with wall-like “mortar/brick” structures for electromagnetic interference shielding [期刊论文] Science Bulletin, 2020-01-01, 65 (8 Liang C.; Qiu H.; Song P.; Shi X.; Kong J.; Gu J.
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| Persistent surface states with diminishing gap in MnBi2Te4/Bi2Te3 superlattice antiferromagnetic topological insulator [期刊论文] Science Bulletin, 2020-01-01, 65 (24 Xu L.; Mao Y.; Wang H.; Li J.; Chen Y.; Xia Y.; Li Y.; Pei D.; Zhang J.; Zheng H.; Huang K.; Zhang C.; Cui S.; Liang A.; Xia W.; Su H.; Jung S.; Cacho C.; Wang M.; Li G.; Xu Y.; Guo Y.; Yang L.; Liu Z.; Chen Y.; Jiang M.
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| Monolayer NbF4: a 4d1-analogue of cuprates [期刊论文] Science Bulletin, 2020-01-01, 65 (22 Yang Y.; Wang W.-S.; Ting C.-S.; Wang Q.-H.
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| C-V characteristics of piezotronic metal-insulator-semiconductor transistor [期刊论文] Science Bulletin, 2020-01-01, 65 (2 Zheng J.; Zhou Y.; Zhang Y.; Li L.; Zhang Y.
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